EP Patent

EP4427794A1 — Microneedle assembly

Assigned to Daewoong Therapeutics Inc · Expires 2024-09-11 · 2y expired

What this patent protects

An example embodiment of the present disclosure provides a microneedle assembly including: a mold having one or more concave portions formed in an upper surface thereof and microneedles molded by being injected into the one or more concave portions; and an applicator detachably c…

USPTO Abstract

An example embodiment of the present disclosure provides a microneedle assembly including: a mold having one or more concave portions formed in an upper surface thereof and microneedles molded by being injected into the one or more concave portions; and an applicator detachably coupled to the upper surface of the mold, in which the applicator is formed in a plate shape, and has a first surface which protects the microneedles so that the microneedles are not to be exposed during packaging and a second surface on which an adhesion portion is formed to be attached to the microneedles during use.

Drugs covered by this patent

Patent Metadata

Patent number
EP4427794A1
Jurisdiction
EP
Classification
Expires
2024-09-11
Drug substance claim
No
Drug product claim
No
Assignee
Daewoong Therapeutics Inc
Source
FDA Orange Book + USPTO grounding via Google Patents

Bibliographic data sourced from FDA Orange Book + USPTO public records. Plain-English summary generated by AI grounded in source text. Patent term extensions (PTR, SPC, pediatric) may shift the effective expiry. Not legal advice.

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