EP1345268A2 — Thermal dissipation assembly for electronic components
Assigned to Delphi Technologies Inc · Expires 2003-09-17 · 23y expired
What this patent protects
An electrical assembly 10 is provided, including a heat sink 14, a heat generating component 12, a gap 22 defined between the heat generating component 12 and the heat sink 14, at least one pre-cured thermal adhesive member 26 positioned within the gap 22, and a post-cured therma…
USPTO Abstract
An electrical assembly 10 is provided, including a heat sink 14, a heat generating component 12, a gap 22 defined between the heat generating component 12 and the heat sink 14, at least one pre-cured thermal adhesive member 26 positioned within the gap 22, and a post-cured thermal adhesive filling said gap 22.
Drugs covered by this patent
Bibliographic data sourced from FDA Orange Book + USPTO public records. Plain-English summary generated by AI grounded in source text. Patent term extensions (PTR, SPC, pediatric) may shift the effective expiry. Not legal advice.
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